I think that I see some ground stitching vias other improvements in the main board layout. One thing that is needed over RED is improved EMC layout, and it looks like things might be headed in that direction. Based on circuit density, has the board gone to multi-layer? If so, that is a good thing despite the increased cost. Impedance control and grounding should be better.
Keep up the good work and thanks for the teaser pictures!
Greg Hamel
Keep up the good work and thanks for the teaser pictures!
Greg Hamel
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